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Jabil's Global Commodity Intelligence Archive
Global Commodity Intelligence
Q3 2024 | JULY - SEPTEMBER
Jabil's Global Commodity Intelligence Archive
Global Commodity Intelligence
Q3 2024 | JULY - SEPTEMBER
HIGH END SEMICONDUCTOR COMMODITIES
MCU / MCP / CHIPSET / ASIC / PROG LOGIC
SUPPLY
- Supply is healthy, though the market outside AI/Cloud remains relatively soft. Mobile demand was weak in Q2 but is expected to see a seasonal uptick in Q3. The broad industrial market still shows softness, and there are indications of a slowdown in automotive EV sales.
- Traditional networking business remains weak, while 5G faces challenges due to a slowdown in India, partially offset by an improving outlook in North America, which should see growth in late 2024.
- In the longer term, AI opportunities drive up semiconductor content, similar to secular growth trends in electric vehicles, renewable energy, and energy storage systems. A market rebound is expected towards early 2025.
- Foundry: Healthy
- Substrate: Healthy
- Back-End: Healthy
- MCU: Healthy for most product lines, with long lead times remaining for automotive product families.
- STMicroelectronics:
- Lead times for mainstream MCUs (STM32F, L, U, MP series) remain flat at 14 to 19 weeks.
- Some higher-performance MCUs (H5/H7) have slightly increased lead times of 19 to 21 weeks.
- The automotive portfolio remains tight, with SPC products at 30 to 60 weeks.
- Microchip:
- Lead times are healthy, ranging from four to 12 weeks for most products, though some devices still have lead times over 26 weeks.
- Microchip asks for 20 weeks of visibility due to the broad product mix.
- NXP:
- Lead times for most MCUs/MPUs remain stable at 13 to 23 weeks—LPC (13 weeks), RT (15 weeks), i.MX6/7 (16 to 23 weeks).
- Kinetis (MK series) and automotive series S32K1 from GF90nm have improved to 26 weeks.
- TI: Healthy lead times for most products
- Wireless (CC1xxx/CC2xxx/CC3xxx) are at six to 12 weeks, modules up to 20 weeks
- MSP430 and TM4C MCU’s are in a six-to-20-week range
- DSP’s (TMS320) and Sitara MPU’s (AMxxx) are at 6 to 20 weeks
- Infineon/Cypress:
- CY8Cxx – former Cypres portfolio: 10 to 16 weeks
- Aurix TC2xx/TC3xx : 26 weeks, automotive remains tight
- Renesas:
- Lead times remain healthy, 12 weeks for MCU’s
- Newer generation automotive MPU’s RH850 are in a 20-to-24-week range
- Silicon Labs:
- families remain at 12 to 16 weeks
- STMicroelectronics:
- SoC business: supply is healthy in general
- Marvell: Lead time is 26 to 34 weeks for most products
- Broadcom: Lead times remain at 52 weeks. Consumer products from BVG have an average lead time of 26 weeks.
- Qualcomm: Lead times are approximately 35 weeks
- Intel: Supply for EPG products is healthy
- FPGA: supply remained stable in the past quarter and is healthy in general
- AMD/Xilinx:
- Most products are in a 12 to 30 weeks lead time range; Xilinx is asking for 52 weeks of visibility.
- Some specific devices in Ultrascale+ families still have extended lead times up to 52 weeks.
- Xilinx: planned discontinuation of CPLD’s and legacy FPGA’s (Spartan 2 and Spartan 3 families).
- Last Time Buy is June 2024; carefully manage the longevity requirement.
- Intel: Lead times are healthy
- 16 weeks for newer generation products, Arria V and older generation products are <26 weeks
- Microchip:
- Supply improved to a 15-week average; some products are tight with lead times more than 26 weeks
- Lattice:
- Lead times are 16 weeks for most product lines, some older generation devices are now 20 weeks.
- AMD/Xilinx:
- CPUs: Intel supply is healthy in general
- RF semiconductors: lead times are healthy in a range of 12 to 40 weeks
- Qorvo: lead times are stable, most products are below 24 weeks
- Skyworks: lead times are 16 weeks in general
- NXP: lead times generally are below 20 weeks
- Mini-Circuits: lead times for all products are 12 weeks or below
MARKET DYNAMICS
- Renesas acquired PCB design software company Altium for approximately USD 5.9 billion. This acquisition will diversify Renesas' offerings into software, bolster its position as a solution provider, reduce design complexity, accelerate innovation, and shorten the time to market for its products.
- Microchip has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on low- and mid-end FPGAs.
- The US government plans to issue additional grants through the CHIPS and Science Act following the announcements for Microchip and GlobalFoundries last quarter.
- TSMC is slated to receive a USD 6.6 billion grant and USD 5 billion in loans to build a third chip factory in Phoenix, Arizona.
- Samsung will receive a USD 6.4 billion grant to expand its existing facility in Austin, Texas.
- Micron is poised to receive a USD 6.1 billion grant for new semiconductor plants in New York and Idaho.
- Intel’s USD 8.5 billion grant and USD 11 billion in loans will support construction and modernization projects in Arizona, New Mexico, Ohio, and Oregon.
PRICE
- Pricing will remain stable for Q3 2024 as manufacturers aim to retain current margin levels.
- Suppliers continue to shift focus away from legacy devices, implementing price increases and accelerating End of Life (EOL) processes.
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