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Jabil's Global Commodity Intelligence Archive
Global Commodity Intelligence
Q3 2023
Jabil's Global Commodity Intelligence Archive
Global Commodity Intelligence
Q3 2023
HIGH END SEMICONDUCTOR COMMODITIES
MCU / MCP / CHIPSET / ASIC/ PROG LOGIC
- In general, supply improved significantly in the past months for high-end semiconductor devices. Book-to-bill ratios have been low due to continued softness in consumer and mobile market demand.
- Demand is expected to pick up again in Q3 due to increased electronics content for automotive applications and strength in core industrial, renewable energy, and healthcare applications.
- Generative AI has garnered much attention in the press, with significant growth expectations for edge applications and cloud business over the coming years.
- Suppliers are continuing to improve lead times with further improvements by the 2nd half of 2023. We still see continued bottlenecks in specific product families.
- Foundry: improving, still constrained in older generation technology, due to limited capacity expansion.
- Substrate: improving, some limited bottlenecks.
- Back-End: healthy.
- MCU: further improved, long lead times remain for automotive-related products.
- STMicroelectronics: lifted NCNR for new orders (delivery beyond 2023)
- Lead times improved to 20-24 weeks for mainstream MCUs (STM32F0/1/3, G0/1, L0/4/5, U5, MP14/15 series)
- High-performance MCU (STM32F2/4/7 & H5/H7) and Wireless MCUs remain tight with 52 weeks lead time.
- Automotive remains constrained with SPC products @ 63 weeks.
- Microchip: sticks to NCNR terms within the PSP program.
- STMicroelectronics: lifted NCNR for new orders (delivery beyond 2023)
- Lead times improved significantly, but it’s difficult to manage the mix due to highcapacity utilization.
- Orders are booked against 52 weeks.
- NXP: sticks to NCNR for the DAP23 program.
- Most MCUs/MPUs improved to 20-26 weeks lead time.
- Kinetis (MK series) and S32K1 automotive series remain very constrained (>52w).
- NXP will implement a more flexible prioritization program for MK and S32K1 under the SVP24 to secure supply in 2 phases – 1st half of 2024 and 2nd half of 2024.
- TI: healthy lead times for most products.
- Wireless (CC1xxx/CC2xxx/CC3xxx) are at 12-26 weeks
- MSP430 MCU is in a 12-20-week range, TM4C at 12-26 weeks
- DSPs (TMS320) and Sitara MPUs (AMxxx) are at 12-26 weeks
- Infineon/Cypress: lead time remains at 52 weeks throughout 2023
- Renesas: lead times remain healthy; 18 to 36-week range
- Silicon Labs:
- Small lead time improvements for older generation EFR32/EFM32 product families.
- Supply for series 2 devices (EFx32xx2 ) is healthy at 20-26 weeks.
- SoC business: supply continues to improve, but older nodes above 65nm remain somewhat constrained, especially for ethernet-related products. Supply for Wireless SoCs (WIFI/BT) is healthy.
- Marvell: lead time is 26 weeks for most products, all products are NCNR.
- Broadcom: lead time remains at 52 weeks; all products are on NCNR. Consumer products from BVG have a 26-week lead time on average.
- Qualcomm: lead times are in a 40-week range.
- Intel: Supply for EPG products improved.
- Microchip: lead time is at 52 weeks with still limited flexibility for LAN/USB/VSC products.
- FPGA: supply improved significantly in recent months; NCNR and allocation will be lifted for most product families.
- Xilinx: lead times are improved; NCNR is lifted for Q3 2023 onwards. Still asking for 1 year of visibility
- Some bottlenecks for Artix-7 products due to substrate constraints.
- Spartan-6 devices are at 35 weeks.
- Target to get to 20 weeks range in the 2nd half of 2023 for most families. Depending on each specific device.
- Intel: significant improvement for all product families; allocation/NCNR will be lifted as of mid-July 2023.
- MAX-II,V,10 and Cyclone-III, IV,10 will come out of allocation as of July 17th with lead times in the 26 weeks range.
- Backlog for all other product families is recovered with expected lead times of 22-26 weeks in Q3.
- Microchip: supply remains very tight for some product families like SmartFusion 2, with lead times in the 60-week range.
- Lattice: indicating further improvements with the expectation of lead times below 24 weeks for all products by the end of CQ3 2023. Lattice is asking for 1 year of visibility.
- LC4xxx, M4A5, XO2, XO3 are still somewhat constraint (48 weeks), expected to improve to 24 weeks by end of Q3.
- CPUs: Intel supply is healthy, in general.
- RF semiconductors: lead times are decreasing to a range of 16-40 weeks; the mobile market was very soft, looking to gain in the 2nd half of 2023, but overall, 2023 looks to be a flat year with almost no growth.
- Qorvo: lead times are decreasing, seeing moderate growth in 2023.
- Skyworks is reducing lead times to 16 weeks in general.
- Anaren is expecting slight growth in the second half of the year.
- Despite some downside in recent quarters, the semiconductor industry is expected to grow significantly in the coming 5-7 years with projections of reaching a USD 1 trillion market.
- High-performance computing solutions will be a significant driver of growth. IDMs and foundries as well as governments continue to invest significantly over the coming years. Regional Chips Act budgets are expected to be released in the coming quarters.
- Pricing is expected to remain stable after numerous price adjustments in 2022 and the first half of 2023.
- Some increases are projected. RF suppliers look to have stabilized their pricing, but Skyworks and Qorvo are suggesting small increases due to increased labor and material costs.
- Suppliers continue to de-focus on legacy devices with price increases and accelerated EOL.
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