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Jabil's Global Commodity Intelligence Archive
Global Commodity Intelligence
Q2 2024 | APRIL- JUNE
Jabil's Global Commodity Intelligence Archive
Global Commodity Intelligence
Q2 2024 | APRIL- JUNE
HIGH END SEMICONDUCTOR COMMODITIES
MCU / MCP / CHIPSET / ASIC/ PROG LOGIC
SUPPLY
- Supply is healthy; the market outside AI/Cloud is still relatively soft, but overall bookings are improving versus the previous quarter for broad-range manufacturers. The mobile and computing business is slowly growing, while the server market remains relatively weak. AI opportunities drive up semiconductor content, similar to secular growth trends in electric vehicles, renewable energy, and energy storage systems.
- Foundry: Healthy for most technologies, with limited constraints.
- Substrate: Healthy
- Back-End: Healthy
- MCU: Healthy for most product lines, long lead times remain for automotive product families.
- STMicroelectronics:
- Lead times remain flat at 14-16 weeks for mainstream MCUs (STM32F, L, U, MP series)
- Some higher-performance MCU’s (H5/H7) are at 19 weeks
- Automotive portfolio remains constrained with SPC products at 60 weeks
- Microchip:
- Lead times are healthy in 4-12 weeks for the majority, but there are specific components still quoted at > 40 weeks.
- PSP will no longer be supported for new POs. A microchip is requesting at least 20 weeks of visibility.
- NXP:
- Time for most MCUs/MPUs remains stable at 13-26 weeks – LPC (13 weeks), RT (15 weeks). I.MX6,7 (16-26 weeks)
- Kinetis (MK series – 26+ weeks) and automotive series (S32K1 – 52 weeks) remain longer due to GF 90nm
- STMicroelectronics:
- TI: Healthy lead times for most products
- Wireless (CC1xxx/CC2xxx/CC3xxx) are at six to 14 weeks, modules up to 26 weeks
- MSP430 and TM4C MCUs are in a six to 26-week range
- DSPs (TMS320) and Sitara MPUs (AMxxx) are at six to 26 weeks
- Infineon/Cypress:
- CY8Cxx – former Cypres portfolio: 10-16 weeks
- Aurix TC2xx/TC3xx: 43 weeks, automotive remains tight
- Renesas: Lead times remain healthy in 12 to 36 weeks
- Silicon Labs:
- EFR32/EFM32 product families improved to 12-16 weeks
- SoC business: supply is healthy in general, with some bottlenecks in older nodes above 65nm
- Marvell: Lead time is 26-34 weeks for most products
- Broadcom: Lead times remain at 52 weeks. Consumer products from BVG have a 26-week lead time on average
- Qualcomm: Lead times are in a 35-week range
- Intel: Supply for EPG products is healthy
- FPGA: supply remained stable in the past quarter and is healthy in general
- Xilinx:
- Most products are in a <20 weeks lead-time range; Xilinx is asking for 52 weeks of visibility
- Some specific devices in Ultrascale+ families still have extended lead times of up to 52 weeks
- Xilinx: planned discontinuation of CPLDs and legacy FPGAs (Spartan 2 and Spartan 3 families).
- LTB is June 2024; please carefully manage the long-term requirements.
- Intel: Lead times are healthy
- 16 weeks for newer generation products, Arria V and older generation products are <26 weeks
- Microchip:
- Lead times improved to an average of 15 weeks; some products are tight, with lead times at 40 weeks
- Lattice:
- Times are below 24 weeks for all products
- Xilinx:
- CPUs: Intel supply is healthy in general
- RF semiconductors: lead times are healthy in a range of 12 to 40 weeks
- Qorvo: lead times are stable, and most products are below 24 weeks
- Skyworks: lead times are 16 weeks in general
- TI: lead times continue to be 14 weeks
- NXP: lead times generally are below 26 weeks
- Mini-Circuits: lead times for all products are 12 weeks or below
MARKET DYNAMICS
- Intel launched its PSG (FPGA products) business as a spin-off company on the first of this year (1 January 2024) and branded it under the former name Altera.
- The U.S. Department of Commerce awarded two grants under the CHIPS (Creating Helpful Incentives to Produce Semiconductors) Act:
- Global foundries will receive USD 1.5 billion in funds to enable new facilities and capacity expansion at their New York and Vermont sites. These foundries produce essential automotive, communications, and defense semiconductor technologies.
- Microchip will receive USD 162 million to expand its facilities in Gresham and Colorado.
- TSMC announced further expansion in Japan with USD 20 billion investments in a new facility that should be operational by 2028 to support the domestic industry with 6 and 7nm solutions. The Japanese Government supports this. Intel is expected to close funds of more than USD 10 billion in the short term to support expansion in Ohio, Arizona, and New Mexico. There are also ongoing conversations with Micron and TSMC.
- Qorvo acquired Anokiwave, a high-performance RF front-end solution supplier, enabling them to supply highly integrated solutions for defense, aerospace, and network infrastructure applications. On the mobile business side, Qorvo sold their back-end manufacturing sites in China to Luxshare. Luxshare will continue to build products for Qorvo under a Strategic Partnership.
PRICE
- Pricing will remain stable through Q2 2024 as manufacturers want to retain current margin levels.
- Suppliers continue to defocus on legacy devices, quoting price increases and accelerated EOL.
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