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Jabil's Global Commodity Intelligence Archive
Global Commodity Intelligence
Q4 2022
Jabil's Global Commodity Intelligence Archive
Global Commodity Intelligence
Q4 2022
HIGH END SEMICONDUCTOR COMMODITIES
MCU / MCP / CHIPSET / ASIC/ PROG LOGIC
- Supply for high-end semiconductor devices remains constrained. Manufacturers continue to publish positive book-to-bill ratios. They are benefiting from secular growth trends which drive additional electronics content in applications like automotive, renewable energy 5G and IoT. The significant softening in demand for consumer related applications, somewhat stabilizes output and will allow manufacturers to catch-up. It remains difficult for manufacturers to manage the mix and we see continued bottlenecks in specific product families, mainly due to limitations in capacity expansion at foundries. Products built in older process nodes (40nm and above) remain problematic, it’s expected the situation will remain constrained throughout at least the first half of 2023.
- Front-End: bottlenecks at the majority of older generation fabs.
- Back-end: challenging conditions like power outages and Covid shutdowns in China are causing short notice decommitments from raw material suppliers as well as assembly and final test.
- MCU: most of the products remain on allocation, NCNR programs are implemented for 2023.
- STMicroelectronics: Lead time is 72 weeks for all MCU products, STM has booked throughout all of 2023. STM32F, STM8S remain major supply challenges.
- Microchip: Lead time is 62 weeks for all MCU’s with products within the PSP program being on NCNR. Supply for parts flagged PSP is relatively stable, but there are no options to pull-in.
- NXP: Lead time remains at 52 weeks for most MCU and MPU’s. NXP has implemented an NCNR program for 2023. Bottleneck devices include MK/Kinetis (Global Foundries 90TFS process) series and I.MX25x for which output is minimal, NXP is guiding to redesign to newer generation products.
- TI: is requesting to add visibility to 78 weeks in to manage the longer-term backlog. Wireless products like CC1xx/CC25xx continue to be extremely tight.
- Infineon/Cypress: Lead times are 52 weeks for MCU’s, most wireless MCU’s remain on allocation.
- Renesas: Lead times remain at 52 weeks, implemented NCNR program for 2023.
- Silicon Labs: EFR32/EFM32 product family remains very constrained. The recommendation is to move to the Series 2 devices – EFx32xx2.
- SoC business: Severe shortages on older nodes, 40nm and above. Ethernet products remain problematic, older generation WI-FI solutions remain very constrained.
- Marvell: Lead times are greater than 60 weeks, all products are on NCNR.
- Broadcom: Lead times are greater than 60 weeks, all products are on NCNR.
- Qualcomm: Most SoC products are on allocation.
- Intel Ethernet product: EPG products are on allocation and visibility is within a 14-week window.
- Microchip: Lead times are greater than 60 weeks with limited flexibility for LAN/USB/VSC products.
- FPGA: supply is very severe as there is limited capacity in older generation nodes – 40nm/55nm/180nm.
- Xilinx: situation remains severe
- Supply for Spartan-6 devices is limited and remains on hard allocation. Current allocation is extended through March 2023.
- Xilinx is asking 18 months visibility.
- Intel: all devices are under allocation except Stratix 10 and Agilex. Allocation through October 2022 is published, in October allocation through March 2023 will be announced. OEMs should share their allocation requirements to Intel.
- Max-V (180nm), Max-10 (55nm) allocation remains limited.
- Enpirion DC-DC module portfolio is LTB, LTS is March 2023.
- Microchip: supply is tight with lead times in the 60-week range.
- Lattice: tight supply with lead times continuing to increase (> 62 weeks) due to high demand.
- CPUs: Intel supply is tight with prioritization on Ice Lake, which limits output on previous generation CPUs
- There is still a lot of emphasis on capacity expansion to overcome the current supply constraints and plan for future growth. Some of the recent developments:
- The CHIPS Act was signed into US law in August 2022. This covers a range of over $280B in subsidies, with more than $52B specifically for the semiconductor industry into 2026. Subsidies will be granted for expansion programs in US.
- STM and GlobalFoundries announced in July a new 300mm factory in Crolles, France, for FD-SOI technology. The investment is in the range of $5.7B and should be operational by 2026.
- SMIC, a China-based foundry, announced a $7.5B investment for a new 300mm fab in Tianjin, focus will be on 28nm and above.
- Some suppliers continue to implement price increases in Q3 2022. Recent price increases include:
- Intel: 10-20% range increase for shipments as of October 9, 2022.
- Broadcom: 5% range for shipments as of 2023.
- It’s expected the foundries will implement another price increase by early 2023, in the 5-10% range for both advanced and mature nodes, according to indications from TSMC.
- Suppliers continue to defocus on legacy devices with price increases and accelerated EOL.
- Intel increased pricing for the Enpirion portfolio by 3x in October.
- Some older product portfolios are being discontinued with very short notice.
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