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Jabil's Global Commodity Intelligence Archive
Q3 2022
Jabil's Global Commodity Intelligence Archive
Q3 2022
HIGH END SEMICONDUCTOR COMMODITIES
MCU / MCP / CHIPSET / ASIC/ PROG LOGIC
- Supply for high-end semiconductor devices remains heavily constrained due to continued strong demand. Book-to-bill ratio’s have reduced slightly from previous quarters, but remain in a range of 1 – 1.2:1. Besides a drop in demand for consumer, due to inflation and lock-down in China, most market verticals remain strong. It remains difficult for manufacturers to manage the mix and we see continued bottlenecks in specific product families, mainly due to limitations in capacity expansion at foundries. We expect the situation to remain constrained through the majority of 2023.
- All nodes in the supply chain are constrained.
- Front-end: the majority of older generation fabs (8” 130nm, 180nm, 12” 40nm, 65nm, 90nm) continue to be severely constrained with many product families remaining in allocation. Most manufacturers have implemented NCNR orders throughout CY2022.
- Back-end: remains overall critical due to raw material shortages – lead frames and substrates – and some impact by Covid shutdown in China. We expect to continue to see some short notice decommitments due to OSAT’s running at full capacity. Most manufacturers are adding back-end capacity internally in the coming quarters.
- MCU: majority of the products are on allocation.
- STMicroelectronics: Lead times - 83 weeks for all MCU products as STM wants to book all business throughout 2023. Lead-time is a reference, all MCU products are on allocation, STM32F, STM8S have a severe supply shortage.
- Microchip: Lead times - 62 weeks for all MCU’s with products within the PSP program being NCNR. Supply for parts flagged PSP is relatively stable, parts not in PSP continue to be pushed out.
- NXP: Lead time remains - 52 weeks for most MCU and MPU’s. NXP is implementing an NCNR program for 2023. Bottleneck devices include MK/Kinetis (Global Foundries 90TFS process) series and IMX25x for which output is minimal, NXP is guiding to redesign to newer generation products (MK -> LPC55, IMX25x -> IMX6ULL).
- TI: is requesting adding visibility to 78 weeks in order to manage the longer term backlog. Wireless products like CC1xx/CC25xx continue to be extremely tight.
- Infineon/Cypress: Lead times are 52 weeks for MCU’s, most wireless MCU’s remain on allocation.
- Renesas: Lead times remain at 52 weeks. Renesas is launching the DSP program for 2023.
- Silicon Labs: EFR32/EFM32 product family remains very constrained. The recommendation is to move to the Series 2 devices – EFx32xx2.
- SoC business: Severe shortages on older nodes, 40nm and above. Ethernet products are problematic, older generation WiFi solutions remain very constrained.
- Marvell lead times > 60 weeks, all products are NCNR.
- Broadcom: Lead times > 60 weeks, all products are NCNR.
- Qualcomm: Most SoC products are on allocation.
- Intel Ethernet product: EPG products are now on allocation; visibility is within a 14-week window.
- Microchip: Lead time > 60 weeks with limited flexibility for LAN/USB/VSC products.
- FPGA: supply is very severe as there is limited capacity in older generation nodes – 40nm/55nm/180nm.
- Xilinx: situation is getting more severe
- Supply for Spartan-6 devices is further reducing, this product line is on hard allocation.
- Xilinx did a re-alignment for 16nm-28nm devices, which includes Spartan-7 and their Ultrascale devices. Most schedules have been pushed-out.
- Xilinx is asking 18 months of visibility.
- Intel: all devices are under allocation except Stratix 10 and Agilex
- Max-V (180nm), Max-10 (55nm) are severely impacted by the lack of supply from foundry, allocation is done based on OEM. Supply for most other FPGA families is very tight.
- Enpirion DC-DC module portfolio went Last Time Buy on March 18. It’s highly recommended to implement alternate options from TI, MPS or ADI. Intel can’t guarantee they have sufficient capacity to support all LTB demand, last shipment will be March 2023.
- Microchip: supply is tight with lead times in the 60 week range.
- Lattice: tight supply with lead time moving out to 52-62 weeks due to high demand and increased conversion business from Xilinx and Intel.
- Xilinx: situation is getting more severe
- CPU’s: Intel supply is tight with prioritization on Ice Lake, which limits output on previous generation CPU’s.
- RF semiconductors: lead times remain high at 20-24 weeks.
- Broadcom has bid to acquire VMware in a cash-and-stock transaction of approximately $61B. This deal will advance Broadcom’s strategy to build the world’s leading infrastructure technology company. This accelerates software scale and aims to lift the software revenue to almost 50% of their business.
- Some suppliers continue to implement price increases in Q2 2022. Recent price increases include:
- NXP: 10-20% range as of July
- Lattice: 15% range in June
- Broadcom: 5% range for shipments as of 2023
- It’s expected that the foundries will implement another price increase by early 2023, in the 5-10% range for both advanced and mature nodes, according to indications from TSMC.
- Suppliers continue to defocus on legacy devices with price increases and accelerated EOL.
- Intel increased pricing for the Enpirion portfolio by 3x by in April and another 3x expected in October.
- Some older product portfolios are being discontinued with short to no advance notice.
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