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Jabil's Global Commodity Intelligence Archive

Global Commodity Intelligence

Q1 2024 | JANUARY- MARCH

HIGH END SEMICONDUCTOR COMMODITIES

MCU / MCP / CHIPSET / ASIC/ PROG LOGIC

SUPPLY

i

supply

L/T Increase

Allocation

No Constraints


Demand and capacity specifics, change factors and forecasts

Q1'24

Q2'24

Q3'24

Q4'24

Microprocessor

Q1'22

Q2'22

Q3'22

Q4'22

Prog Logic

Q1'22

Q2'22

Q3'22

Q4'22

Chip Set

Q1'22

Q2'22

Q3'22

Q4'22

SUPPLY

Supply is healthy, with book-to-bill ratios just below 1, and overall bookings are somewhat improving versus the previous quarter, with the market expected to bottom out in late 2023. Mobile and computing business is slowly picking up again. The server market is relatively weak; AI opportunities drive up semiconductor content, similar to secular growth trends in electric vehicles, renewable energy, and energy storage systems.

      • Foundry: Healthy for most technologies, with limited constraints in legacy technology nodes.
      • Substrate: Healthy
      • Back-End: Healthy
  • MCU: healthy for most product lines; long lead times remain for automotive product families.
    • STMicroelectronics:
      • Lead times improved to 12-15 weeks for mainstream MCUs (STM32F, L, U, MP series)
      • Some higher-performance MCU’s (H5/H7) are at 19 weeks
      • The automotive portfolio remains constraint with SPC products at 60 weeks
    • Microchip: .
      • Lead times are healthy at four to 12 weeks for the majority, but there is a broad mix still in 52-60 weeks
      • It’s recommended to have 26 weeks of order visibility in line with the PSP
    • NXP:
      •  Time for most MCUs/MPUs improved to 13-26 weeks – LPC (13 weeks), RT (16 weeks). I.MX6,7 (16-26 weeks)
      • Kinetis (MK series – 26 weeks+) and automotive series (S32K1 – 52 weeks)  remain critical due to Global Foundries 90nm
      • TI: Healthy lead times for most products
        • Wireless (CC1xxx/CC2xxx/CC3xxx) are at 6-14 weeks, modules up to 26 weeks
        • MSP430 and TM4C MCUs are in a six to 26-week range
        • DSPs (TMS320) and Sitara MPUs (Amex) are at six to 26 weeks
      • Infineon/Cypress:
        • Lead times remain in the 39-week range for the majority of the product lines; automotive is constrained
      • Renesas: Lead times remain healthy in a 12-36 week range
      • Silicon Labs:
        • Small lead time improvements for older generation EFR32/EFM32 product families
        • Supply for series two devices (EFx32xx2 ) is healthy at 16-26 weeks
      • SoC business: supply is healthy in general, with some bottlenecks in older nodes above 65nm
          • Marvell: Lead time is 26 weeks for most products
          • Broadcom: Lead times remain at 52 weeks. Consumer products from BVG have a 26 we35-weeks lead time on average
          • Qualcomm: Lead times are in a 35-week range
          • Intel: Supply for EPG products is healthy
      • FPGA: supply improved in the past quarter and is healthy in general
          • Xilinx: Most products are in a <20 weeks LT range; Xilinx is asking for 52 weeks visibility. Some specific devices in Ultrascale and Ultrascale+ families still have extended lead times of up to 52 weeks
          • Intel: Lead times are healthy. Intel should be able to commit against 16-26 weeks lead time.
          • Microchip: supply remains tight for some product families like SmartFusion 2; lead times are around 52 weeks
          • Lattice: Lead times are below 24 weeks for all products
      •  CPUs: Intel supply is healthy in general
      • RF semiconductors: lead times are healthy in a range of 12-40 weeks
          • Qorvo: lead times are stable
          • Skyworks: lead times are 16 weeks in general

MARKET DYNAMICS

i

market

Churn/ Consolidation

Exit Market

Stable


Commodity demand, supply & capacity, and the supplier landscape

Q1'24

Q2'24

Q3'24

Q4'24

Microprocessor

Q1'22

Q2'22

Q3'22

Q4'22

Prog Logic

Q1'22

Q2'22

Q3'22

Q4'22

Chip Set

Q1'22

Q2'22

Q3'22

Q4'22

MARKET DYNAMICS

    • Broadcom closed its USD 69 billion acquisition of VMWare, a leading provider of multi-cloud services. With this acquisition, Broadcom will further expand its platform of complex technology infrastructure needs.
    • Infineon announced the closure of the GaN Systems acquisition, valued at USD 830 million (in cash transactions). GaN will offer complementary technology for Infineon’s decarbonization strategy to support more energy-efficient applications.
    • In general, the semiconductor CAPEX has somewhat slowed down compared to the initial projections in 2022.

 

PRICE

i

price

Flat

Increase

Decrease


Pricing specifics, change factors, trends and forecast rationale

Q1'24

Q2'24

Q3'24

Q4'24

Microprocessor

Q1'22

Q2'22

Q3'22

Q4'22

Prog Logic

Q1'22

Q2'22

Q3'22

Q4'22

Chip Set

Q1'22

Q2'22

Q3'22

Q4'22

PRICE

    • Pricing will remain stable for Q1/2024 as manufacturers want to retain current margin levels.
    • Suppliers continue to defocus on legacy devices with price increases and accelerated EOL.
      • NXP will implement price increases for LPC1, I.MX2, and MPC series due to high maintenance costs for reduced output.

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